The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2002
Filed:
May. 11, 2001
Denso Corporation, Kariya, JP;
Abstract
A semiconductor device mount structure includes a heat dissipating member, a circuit board, a semiconductor device and a leaf spring member. The heat dissipating member has a mounting surface. The circuit board is opposed to the mounting surface of the heat dissipating member. The semiconductor device is mounted to the mounting surface of the heat dissipating member. The semiconductor device is electrically connected to the circuit board. The leaf spring member is arranged between the semiconductor device and the circuit board in such a manner that the leaf spring member biases the semiconductor device against the mounting surface of the heat dissipating member. The leaf spring member has a heat insulating material integrated on one side thereof which faces the circuit board.