The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2002
Filed:
Jul. 28, 1999
Hideki Suzuki, Ihara-gun, JP;
Ichiro Okamoto, Ihara-gun, JP;
Kazumitsu Mizushima, Inazawa, JP;
Tadashi Asahi, Tokyo, JP;
Hirokazu Sawada, Haibara-gun, JP;
Hirokazu Sakaki, Haibara-gun, JP;
Other;
Abstract
The present invention provides a support for a lithographic printing plate prepared by cold rolling a sheet while intermediate annealing is omitted to save energy and the number of the cold rolling steps are decreased to simplify the sheet production steps and to give a desired strength of the sheet, and by inhibiting precipitation of Si particles in the substrate to give extremely excellent resistance to ink staining in the nonimage areas during printing, and a process for producing a substrate therefore. The production process comprises homogenization heat-treating an aluminum alloy slab comprising 0.10 to 0.40 wt % of Fe, 0.03 to 0.15 wt % of Si, 0.004 to 0.03 wt % of Cu, and the balance of Al and unavoidable impurities, hot rolling the heat-treated slab, and cold-rolling the hot-rolled strip without intermediate annealing, the cold rolling including a final pass after which the sheet temperature becomes at least the recovery temperature of the sheet and the following rapid cooling, whereby an aluminum alloy substrate for a lithographic printing plate having a content of precipitated Si of up to 30 ppm and a tensile strength of from 145 to 180 MPa is produced. When the aluminum alloy is electrolytically grained and anodically oxidized, the resultant anodic oxide film can contain up to 200/mm of precipitated Si particles having an average particle size of at least 0.5 &mgr;m.