The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2002
Filed:
Jan. 12, 1999
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A low-cost package for semiconductors that is superior in heat dissipation and capable of preventing the cracking of semiconductor elements at the time of mounting, and a semiconductor module employing the package. The package for semiconductors comprises a CVD diamond substrate made of an independent diamond lamina, and a highly heat-conductive metallic member bonded with the substrate. Semiconductor elements such as MMICs are mounted on an area for mounting semiconductor elements. The CVD diamond substrate may be replaced by a composite in which a CVD diamond layer is formed on a base material having thermal conductivity of 100 W/m·K or more. The provision of protuberances of the metallic member around the CVD diamond substrate prevents the leakage of microwaves and millimeter waves.