The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2002
Filed:
Feb. 09, 2000
Hiroshi Horiuchi, Yokohama, JP;
Taro Asakura, Tokyo, JP;
Hidemi Takeuchi, Asahikawa, JP;
Masato Ooba, Asahikawa, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
The object is to provide a thermal print head that can absorb an expansion due to difference of thermal expansion coefficients of a ceramic substrate and a glass-epoxy based printed circuit board to enable to obtain excellent printing quality, to be high in reliability, and to be capable of downsizing. For this, a thermal print head is constituted to comprise a base provided with heat-generating resistors, a printed circuit board disposed in close proximity to the base, a semiconductor element for driving that is mounted on the base or the printed circuit board and electrically connected to the base and the printed circuit board, and a sealing-member that seals the semiconductor element for driving and includes a hard seal portion consisting of hard sealing-material and a soft seal portion consisting of soft sealing-material more flexible than the hard sealing-material, wherein the hard seal portion is disposed on the base, and the soft seal portion is disposed extended on the base and the printed circuit board.