The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2002

Filed:

Dec. 29, 1998
Applicant:
Inventors:

Hidekazu Toda, Kyoto, JP;

Shinji Isokawa, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 3/300 ;
U.S. Cl.
CPC ...
H01L 3/300 ;
Abstract

A low temperature buffer layer made of GaN is formed on a sapphire substrate and an n type layer is formed thereon. An active layer is made of an InGaN based compound semiconductor. A GaN based compound semiconductor layer including an n-type layer, an active layer serving as a light emitting layer, and a p type layer are laminated on the sapphire substrate. A current diffusion film which is formed on the p-type layer for supplying the light emitting layer with a uniform current is formed of an electrically conductive metal having a high reflectance factor for light. The light emitting diode element is mounted on a circuit board so that the output light of the light emitting layer is emitted from the side of the sapphire substrate. Reflected light which is reflected on the current diffusion film is also emitted from the sapphire substrate.


Find Patent Forward Citations

Loading…