The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2002
Filed:
Jun. 15, 1999
Masahiro Kondou, Yamaguchi, JP;
Minoru Fujita, Yamaguchi, JP;
Hiroaki Nakagawa, Yamaguchi, JP;
Hiroyuki Kurata, Yamaguchi, JP;
Mitsui Chemicals, Inc., Tokyo, JP;
Abstract
According to the present invention, a method of manufacturing a pellicle and a jig for manufacturing a pellicle are provided. The method of manufacturing a pellicle of the present invention comprising the steps of: temporarily coating a thin film which is a constituting member of a pellicle which is a dust cover for a mask used in patterning in manufacturing a semiconductor device or a liquid crystal display plate, on a frame larger than a specified frame which is another constituting member of the pellicle; coating an adhesive on said specified frame in advance; overlapping said larger frame on said specified frame coated with said adhesive; adhering said thin film temporarily coated on said larger frame to said specified frame with said adhesive; transferring said thin film coated on said larger frame to said specified frame from said larger frame; and cutting off a portion of said transferred thin film, the portion of which is protruded from said specified frame, with a physical trimming means, wherein a coating material consisting of an organic solvent and a specified resin dissolved therein is supplied to a cut-off portion intended to be cut off, by said physical trimming means, at the same time or before cutting off said protruded thin film with said physical trimming means.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile