The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2002
Filed:
Jul. 28, 2000
Applicant:
Inventors:
Masuo Koshi, Ikoma, JP;
Kenichirou Todoroki, Hirakata, JP;
Hiroaki Nakayama, Neyagawa, JP;
Tadahiko Sugimoto, Kadoma, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/100 ; B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/100 ; B23K 3/102 ;
Abstract
A soldering method aimed to obtain higher bonding strength than conventionally obtained ones. With the soldering method according to the present invention, a Cu mounting surface is soldered with a preliminary solder comprising Sn-Cu, and a component is finally soldered to this preliminarily soldered surface with a solder comprising Sn-Ag-Cu-Bi. Thus, higher bonding strength can be obtained not only in the interface between the preliminary solder surface and the solder for final soldering, but also in the interface between the mounting surface and the preliminary solder.