The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2001

Filed:

Apr. 12, 1999
Applicant:
Inventors:

Shuhichi Endoh, Fujisawa, JP;

Toshihiro Inoue, Sagamihara, JP;

Satoshi Takikita, Fujisawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 ;
U.S. Cl.
CPC ...
H05K 1/03 ;
Abstract

A thin flexible multi-layered printed circuit cable manufactured by a relatively simple process and having improved electro-magnetic interference and impedance characteristics is described. The cable includes: an insulating substrate layer; a wiring layer formed on the insulated substrate layer; a coating layer laminated on the wiring layer; a first non-woven metal fiber layer laminated on the coating layer; and a second non-woven metal fiber layer laminated on an opposite surface of the substrate layer. Because the cable is coated with a conductive non-woven or woven metal fabric, electromagnetic waves generated during transmission of high speed data are fully shielded. The non-woven or woven fabric having a wide surface area, is soft and can make good surface-to-surface contact.


Find Patent Forward Citations

Endoh, Shuhichi. (2001). Flexible multi-layered printed circuit cable (U.S. Patent No. 6333468). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6333468

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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