The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2001
Filed:
Feb. 17, 2000
Applicant:
Inventors:
Yoshiharu Tanaka, Nyuzen, JP;
Takato Takizawa, Kurobe, JP;
Assignee:
YKK Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
D02G 3/00 ;
U.S. Cl.
CPC ...
D02G 3/00 ;
Abstract
A molding material comprising a reinforcing fiber,bundle evenly sheathed by a resin layer,and having an oblong shape with at least two lengthwise faces that are flat faces,and a method involving thermal preforming of a given amount of the molding material and placing the preformed material into a mold for molding through application of heat and pressure, affording lightweight high-strength molded articles, such as safety shoe toe caps, in high yield.