The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2001
Filed:
Oct. 13, 1999
Applicant:
Inventors:
Assignee:
Daido Tokushuko Kabushiki Kaisha, Aichi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 2/900 ;
U.S. Cl.
CPC ...
G01N 2/900 ;
Abstract
A method for evaluating bonding properties of a metallic pipe, the method comprises steps of measuring, in advance of a pipe expansion operation, at least one selected from a degree of shape discontinuity, a degree of defect at a bonding portion, and a degree of change in crystal structure, and comparing a measurement value with a predetermined threshold value to evaluate suitability of the bonding properties for applying pipe expansion.