The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2001
Filed:
Nov. 12, 1999
Subhash Gupta, San Jose, CA (US);
Susan Hsuching Chen, Sunnyvale, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A method and system for providing a via structure for an integrated circuit is disclosed. The method and system includes providing a high conductivity metal that forms a metal structure consisting of the high conductivity metal. The method and system also includes a dielectric material surrounding the high conductivity metal. The dielectric material includes sidewalls to form a via hole. The method and system also include providing a via plug material other than the high conductivity metal. The via plug material covers the high conductivity metal and substantially fills the via hole. The via plug material substantially covers a base portion of the high conductivity metal and the sidewalls of the via hole. The via plug material is for gettering the high conductivity metal sputtered on the sidewalls of the via hole.