The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2001
Filed:
Oct. 27, 1998
Idemitsu Petrochemical Co., Ltd., Tokyo, JP;
Abstract
A method of producing a laminated structural molding formed from molded resin and an outer layer of facing material. The method comprises the step of initially placing the facing material in a mold. Molten resin is injected into the mold. The resin is spread throughout the mold by locating mold sections adjacent each other at a set compressive force. The partially assembled molding is then subjected to a cooling process in which the compressive force to which the molding is exposed is reduced so that the force is greater than zero but less than the compressive force used to spread the resin. The mold sections do not retract or move during the reduction in the compressive force. The cooling process is performed just before or after the completion of the spreading of the resin. In this way, the damage to the facing material of the molding is kept to a minimum.