The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2001

Filed:

Oct. 05, 1999
Applicant:
Inventors:

Dexter V. Wright, Pittsburgh, PA (US);

Robert Weinert, Monroeville, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/300 ;
U.S. Cl.
CPC ...
H01Q 1/300 ;
Abstract

The technique of shrink fitting technique described herein is used to bond crystalline sapphire pieces to each other, in particular, the shrink fitting of a c-axis sapphire post to a c-axis sapphire puck. The sapphire dielectric resonator is used successfully from cryogenic temperatures to well above room temperature. The shrink fit bond yields a high strength and rigid attachment which can withstand high shock levels. Since there is no loss, the resonator Q is a maximum, being limited by the sapphire loss tangent only.


Find Patent Forward Citations

Loading…