The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2001

Filed:

Aug. 30, 1999
Applicant:
Inventor:

Takahiko Kosemura, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 ;
U.S. Cl.
CPC ...
G02B 6/12 ;
Abstract

A couple of plane type optical emitting/receiving elements are face-down mounted by the flip chip joining method on the upper surface of the multilayer substrate and the through-holes are respectively formed at the area just under the center of plane type optical emitting/receiving elements. At the internal wall of through-holes, the clad layer consisting of conductive layer where the plating process is conducted at the surface thereof is formed and the core layer consisting of the polymer resin is also formed at the center. At the lower surface of multilayer substrate, the optical waveguide extending linearly up to the area just under the other through-hole from the area just under one through-hole is formed. Moreover, the 45° micro-mirrors are respectively formed at both end faces of the optical waveguide.


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