The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2001
Filed:
Nov. 23, 1998
Noriaki Sakamoto, Gunma, JP;
Hisashi Shimizu, Gunma, JP;
Sanyo Electric Co., Ltd., Moriguchi, JP;
Abstract
A support member,is previously molded, a hybrid integrated circuit substrate,is placed thereon, and the support member,on which the hybrid integrated circuit substrate,is placed is placed in a metal mold, then again molded of a thermoplastic resin,The poured high-temperature thermoplastic resin,strikes on the support member,whose bottom surface is directly contacted on the metal mold and the surface of the striking portion is melted and integrated without being deformed . Therefore, full mold substantially covering an entire surface of the substrate is enabled. Epoxy potting is applied to a semiconductor chip and a coil derivation part.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile