The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2001

Filed:

Mar. 09, 2000
Applicant:
Inventors:

Ron Barnett, Santa Rosa, CA (US);

Ilya Alexander Korisch, Somerset, NJ (US);

Zhengxiang Ma, Summit, NJ (US);

Richard F Schwartz, Cranbury, NJ (US);

Hui Wu, Union, NJ (US);

Assignee:

Avaya Technology Corp., Basking Ridge, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 ;
U.S. Cl.
CPC ...
H01Q 1/38 ;
Abstract

A transceiver (,) comprises a stacked metal laminate assembly of a plurality of layers (,) inside an enclosure (,). A first layer (,) forms an antenna. A second layer (,) forms a ground plane for the antenna. A third layer (,) forms “front-end” filters (duplexer). A fourth layer (,) together with the second layer forms an electromagnetic isolation enclosure for the filters. A fifth layer (,) comprises a PC board with electronic circuits of the transceiver mounted thereon, and is both mounted to and electronically shielded by the fourth layer. Each of the first through fourth layers is preferably made from a single metal layer, such as a sheet of metal, by stamping. Each of the first through fourth layers is either bent along its periphery into a substantially “cake-pan” shape, or is flat and has a separate side wall (,) attached thereto. Flanges (,and,) that are unitarily formed with the filters extend through orifices (,and,) in the second and fourth layers to connect the filters with the antenna and the electronic circuits. The connections may be conductive or capacitive. The assembly is put together by stacking the first through fourth layers and then epoxying, soldering, or welding them together.


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