The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2001

Filed:

Apr. 27, 2000
Applicant:
Inventor:

Kazuhiko Terashima, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract

A semiconductor device having a PBGA structure comprising a wiring board, a semiconductor integrated circuit chip, substrate electrodes of the semiconductor integrated circuit chip for electrically connecting the electrodes of the semiconductor integrated circuit chip to the wiring board by connection wires, and a resin sealing body for covering the entire surface of the wiring board to protect the semiconductor integrated circuit chip, wherein the semiconductor integrated circuit chip and the substrate electrodes are respectively provided on the front surface of the wiring board. The semiconductor device further comprising pad electrodes and solder ball terminals respectively provided on the back surface of the wiring board for connecting the wiring board to a mother board, and through holes provided on the wiring board for connecting the substrate electrodes provided on the front surface of the wiring board to the pad electrodes provided on the back surface of the wiring board, wherein the resin sealing body is curved in shape at the peripheral portions.


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