The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2001

Filed:

Jun. 09, 1999
Applicant:
Inventors:

Atsushi Higashiura, Tokyo, JP;

Isamu Kobayashi, Tokyo, JP;

Naoyuki Chida, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 2/700 ; H01B 7/00 ;
U.S. Cl.
CPC ...
B32B 2/700 ; H01B 7/00 ;
Abstract

There is disclosed a multilayer insulated wire which comprises a conductor and solderable extrusion-insulating layers made up of two or more layers for covering the conductor, wherein at least one insulating layer is formed by a mixture comprising 100 parts by weight of a resin (A), of at least one selected from the group consisting of polyetherimide resins and polyethersulfone resins, 10 parts by weight or more of a resin (B), of at least one selected from the group consisting of polycarbonate resins, polyarylate resins, polyester resins, and polyamide resin, and 15 to 200 parts by weight of an inorganic filler (C). There is also disclosed a transformer which utilizes the multilayer insulted wire. The multilayer insulated wire is excellent in heat resistance, solderability, high-frequency characteristic, and coilability, and it is favorably suitable for industrial production. Further, the transformer utilizing the multilayer insulated wire is excellent in electrical properties and high in reliability, since when used at high frequencies, electric properties are not lowered and influence by the generation of heat can be prevented.


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