The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2001

Filed:

Oct. 27, 1997
Applicant:
Inventor:

Nahomi Ohta, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/100 ; H01L 2/164 ; C23C 1/600 ;
U.S. Cl.
CPC ...
H01L 2/100 ; H01L 2/164 ; C23C 1/600 ;
Abstract

In a semiconductor device manufacturing line, a wet process unit area is located at a substantial center of the manufacturing line and is provided with concentratedly arranged wet process units. A plurality of processing unit areas are located around the wet process unit area. A plurality of direct transfer mechanisms for transferring products are arranged between the wet process unit area and the respective processing unit areas, and an area transfer mechanism for transferring products is arranged among the processing unit areas.


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