The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2001
Filed:
May. 21, 1999
Applicant:
Inventor:
Veli-Pekka Ketonen, Irving, TX (US);
Assignee:
Nokia Telecommunications, Oy, Espoo, FI;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract
A heat dissipation mechanism for high power devices allows an automatic pick-and-place and solder assembly of electrical components including the high power devices onto a circuit board in a same pick-and-place and solder process. In the heat dissipation mechanism, a device portion and a flange portion of the high power devices are placed upside down such that the flange portion dissipates heat in the device to mechanics through the circuit board.