Socket for semiconductor devices

Abstract

A socket for semiconductor devices has a contact pin for a semiconductor device that is located on a top surface thereof and a contact pin for a board that is located on a bottom surface thereof, and which is placed between the semiconductor device and the board. The socket includes a socket case and a plurality of films with pins; wherein the films with pins are formed by a plurality of linear conductive elastic constituents arranged in a fixed direction on cut pieces composed of flexible electrical insulators of the same size, and both ends of the linear conductive elastic constituents extend beyond the cut pieces, protruding portions on one end constituting the contact pins for semiconductor devices, while protruding portions on the other end constituting the contact pins for the board; the contact pins for semiconductor devices have a flexure provided by a slider at one or two or more points in a lengthwise direction; an interval between adjoining ones of the contact pins for semiconductor devices is equal to a pitch of semiconductor device terminals, while an interval between adjoining ones of the contact pins for a board is equal to a pitch of terminals on the board; and the films with pins are arranged in the socket case such that surfaces of the films oppose each other, the intervals between the contact pins for semiconductor devices that protrude from adjoining films are equal to the pitch of the semiconductor device terminals, and the intervals of the contact pins for the board that protrude from adjoining films are equal to the pitch of terminals on the board.