The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2001
Filed:
Jun. 22, 2000
Takeshi Kuroda, Hadano, JP;
Kaoru Katayama, Hadano, JP;
Takeshi Takahashi, Hadano, JP;
Naoki Watanabe, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A solder removing apparatus comprises a stage and a head portion. A top face of the stage is a flat surface, and the stage can arbitrarily move in a direction parallel to the top face. On the stage are arranged a first member supplying portion on which one or more first members are located, a second member supplying portion on which one or more second members are located, and a heating portion for heating a member located thereon at an arbitrary temperature. The head comprises a first head and a second head. The first head and the second head can move along the same moving axis in a direction vertical to the top face of the stage independently from each other. The first head adsorbs the first member located on the first member supplying portion and locates the first member on the heating portion. The second head adsorbs the second member located on the second member supplying portion and locates the second member on the first member located on the heating portion. The solder adhering to the second member is melted when heated by the heating portion through the first member and adheres to the first member. As a result, the solder is removed from the second member.