The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2001
Filed:
Aug. 16, 2000
Applicant:
Inventors:
Takesi Suzuki, Kita-kyushu, JP;
Mamoru Sakurai, Kita-kyushu, JP;
Minoru Torihata, Musashi Murayama, JP;
Tatsunari Mii, Tachikawa, JP;
Assignee:
Toto Ltd., Fukuoka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/700 ; B23K 1/06 ;
U.S. Cl.
CPC ...
B23K 3/700 ; B23K 1/06 ;
Abstract
A wire bonding capillary (,), which is able to decrease wire extraction resistance and suitable for a long and low loop wire bonding process, comprises a through bore (,) for feeding a bonding wire, a funnel-shaped bore (,) for guiding the wire to the through bore, and a tapered portion (,) formed at an exit of the through bore. The through bore length is between 0.2 and 1.5 times the through bore diameter. The tapered portion is tapered in two steps.