The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2001

Filed:

Aug. 18, 2000
Applicant:
Inventors:

Akira Ishikawa, Royse City, TX (US);

Nabuo Takeda, Richardson, TX (US);

Suzanne I. Ahn, Dallas, TX (US);

Steven R. Hays, Dallas, TX (US);

Assignee:

Ball Semiconductor, Inc., Allen, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21B 4/712 ; F21B 4/710 ; F21B 4/500 ;
U.S. Cl.
CPC ...
F21B 4/712 ; F21B 4/710 ; F21B 4/500 ;
Abstract

Sensor modules are provided which are pumped into a well by first being pumped downhole within a drill string, then passing through the drill bit and being circulated uphole in the annulus between the drill string and the borehole of the well. The sensors take measurement readings as they are being pumped uphole through the annulus. The sensors are preferably separated from the mud returns from the well, and then read at an inductive read unit. The sensor modules are provided by semiconductor substrates which measure downhole well parameters, and then store the date for retrieval at the surface. The semiconductor substrates preferably have a plurality of sides on which measurement sensors and circuitry may be formed, allowing the circuitry and the sensors to be made of smaller sizes. Such sensors include temperature sensors, three-dimensional stain gauges, which are also useful as pressure transducers, inductive pressure transducers, inclination sensors, accelerometers, gyroscopes and radiation detectors. The sensors and circuitry are preferably provided on spherically shaped semiconductor substrates.


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