The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2001
Filed:
Jun. 16, 2000
Applicant:
Inventors:
Michael T. Borkowski, Westboro, MA (US);
Thomas V. Sikina, Acton, MA (US);
John W. Roman, Natick, MA (US);
Assignee:
Raytheon Company, Lexington, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 ;
U.S. Cl.
CPC ...
H05K 3/34 ;
Abstract
A microwave solid interface module having transmit and receive functionality includes a substrate supporting microwave, logic, and DC bias circuits. In one embodiment, the substrate can be formed from BeO. The module can include a BGA package that provides a connector-less interface for RF, DC, and thermal connections to a supporting module. The BGA structure provides vertical connections between the BGA solder balls and a respective DC signal layer, a microwave signal layer, and a thermally conductive core within the supporting module.