Method and apparatus for modeling electromagnetic interactions in electrical circuit metalizations to simulate their electrical characteristics

Abstract

A so-called multipole decomposition is employed for modeling the charge and current distributions and the interactions of those distributions in metalization sub units arising from electrical signals in those metalization sub units. Specifically, a variable interaction range meshing, i.e., multipole, decomposition process is advantageously employed to model the charge and current distributions of metalization sub units. These distributions are then employed to obtain electrical characteristics of an overall physical metalization structure to be fabricated. In an embodiment of this invention, representative sections of metalization sub units are selected such as straight sections of infinitesimal length, right angle bends and intersections, and solved for the local short range charge and current interactions that determine their local distributions in those sub units. Then, components of the charge and current distributions are selected and separated based on the nature of their interactions with other circuit metalization sub units and the rate at which they can vary in the metalization structure. Only those interactions are retained that can significantly impact the overall metalization structure characteristics and only evaluate those interactions with other metalization sub units during intervals during which those interaction components are capable of changing.