Clamping arrangement for compression-mounted power electronic devices

Abstract

A clamping arrangement is provided for compression mounted power electronic devices that is assembled from component parts to form a clamping module. The clamping module provides suitable clamping force to a power electronic device interposed between two heat sink arrangements. The clamping arrangement utilizes clamping beams disposed on either side of the two heat sinks and the interposed power electronic device, elongated members that span and retain each end of each clamping beam against relative movement, and an arrangement for applying a desired clamping force to the heat sinks and the power electronic device. The kit of component parts can be assembled into a clamping module about a power electronic device disposed between two heat sinks and is easily assembled or field disassembled from economical parts. The clamping modules are also adapted to be easily and efficiently combined into an overall stack of modules to provide a power electronic assembly of series connected power electronic devices for operation at medium voltages. In a preferred arrangement, the elongated members are implemented via the assembly of end cap assemblies about an elongated member. An arrangement to achieve predetermined clamping forces during assembly is also provided.