The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2001
Filed:
Oct. 19, 1999
Applicant:
Inventor:
Yugo Koyama, Ina, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/160 ; H01L 2/1316 ; H01L 2/349 ; H01L 2/358 ;
U.S. Cl.
CPC ...
H01L 2/160 ; H01L 2/1316 ; H01L 2/349 ; H01L 2/358 ;
Abstract
A method of forming a bump, comprising: a first step of bonding a ball-shaped tip portion of a conductive wire to an electrode by a first tool so that a portion of the tip portion, positioned around a central portion that leads to the conductive wire and avoiding an outer peripheral portion, is pressed and plastically deformed by the first tool; a second step of tearing off the conductive wire in such a manner that the tip portion remains on the electrode; and a third step of pressing at least the central portion of the tip portion by a second tool to cause plastic deformation.