The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2001
Filed:
Feb. 03, 1999
John May, Tucson, AZ (US);
Timothy J. Provencher, Oro Valley, AZ (US);
Other;
Abstract
An apparatus for placing solder balls in a pattern on a substrate is provided for, for example, to create a ball grid array. The apparatus comprises a template having a first plane, a second plane, and a plurality of holes. The holes pass substantially orthogonally through the first and second planes so that the template is permeable to a fluid between the first and second planes. The holes correspond in location to the pattern and each of the holes passes through the template along an axis. Each of the holes has a first end adjacent to the first plane with a first cross section substantially parallel to the first plane. The first cross section has a first characteristic dimension, for example, a diameter if the first cross section is circular. In addition each of the holes has a second end adjacent to the second plane with a second cross section substantially parallel to the second plane. The second cross section has a second characteristic dimension. The second characteristic dimension is smaller than the first characteristic dimension and smaller than the solder ball diameter so solder balls will not pass through the template. Each hole further includes a wall extending substantially continuously from the first end to the second end. Related methods are also disclosed.