The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2001
Filed:
Feb. 22, 1999
Rex L. Breunsbach, Clackamas, OR (US);
Paul M. Austen, Milwaukie, OR (US);
Electronic Controls Design, Inc., Milwaukie, OR (US);
Abstract
A system and method for measuring liquid from a liquid dispensing system is disclosed. In an illustrated application, a flux measuring device is described that measures flux dispensed from a flux applicator system. The flux measuring device is a test unit that simulates a printed circuit board. Once the distribution of flux is measured, different parameters in the flux applicator system can be modified to ensure that the proper distribution of flux is applied to printed circuit boards during their manufacture. In one aspect, a mesh board having substantially uniform thickness includes a plurality of spaced-apart holes that extend through the mesh board. The holes are sized so that liquid dispensed from a nozzle that contacts the bottom surface of the mesh board enters the holes and is detected on the top surface of the mesh board. A cover is mounted to the mesh board and uniformly maintains detection material in contact with the top surface of the mesh board. In another aspect, an image is formed on the detection material due to contact with liquid that passes through the holes in the mesh board. Image processing and analysis software may be used to automatically measure the image on the detection material. Based on the measurement, the liquid dispensed from the nozzle or other parameters in the manufacturing process can be modified.