The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Aug. 06, 1999
Applicant:
Inventors:
Walter J Dauksher, Ft. Collins, CO (US);
Pedro F Engel, Ft. Collins, CO (US);
Assignee:
Agilent Technologies, Inc., Palo Alto, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 ;
U.S. Cl.
CPC ...
H05K 1/18 ;
Abstract
A device that reduces the interfacial stress caused by differential thermal expansion in an IC/PC board assembly can be created by attaching an annular part, that has a higher coefficient of thermal expansion, to the IC at an elevated temperature. When the assembly cools the annular part contracts and compresses the IC, increasing the change in size of the IC and reducing the stress in the IC/PC joint.
Quick Actions:
Dauksher, Walter. (2001). Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package (U.S. Patent No. 6320754). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6320754
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile