The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Jan. 24, 2001
Shunji Yamauchi, Tokyo, JP;
Masahiro Ishitsuka, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor manufacturing apparatus includes a film feeder for sequentially feeding a die bonding film; and a film piece cutter for cutting a die bonding film piece having a shape and dimension from the die bonding film fed by the film feeder. Further, the film piece cutter includes a male blade member which has a cutting blade at circumferential edges, reciprocated along a direction, and a female blade member which has an opening and a receiving blade corresponding to the cutting blade of the male blade member at an inner circumferential edge of the opening. The male blade member and the female blade member are alterable, and thus, it is possible to change the shape and dimension of the film piece defined by the cutting blades.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile