The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2001

Filed:

Mar. 25, 1998
Applicant:
Inventors:

Kenji Kamiya, Akishima, JP;

Junji Shiota, Akishima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 2/372 ;
U.S. Cl.
CPC ...
H01R 2/372 ;
Abstract

A wiring substrate is disclosed, which has optimal characteristics for, for example, an active matrix type liquid crystal display device with a thin film transistor. Wiring formed of an Al-Nd-Ti alloy thin film is formed on a glass substrate, and if necessary, a semiconductor element which is electrically connected to the wiring is formed. In this case, the specific resistance of the Al-Nd-Ti alloy thin film is about 8 &mgr;&OHgr; cm if the Nd concentration is 0.75 at % and the Ti concentration is 0.5 at %. Further, even if the resultant substrate is heated at 240-270 C. after the formation of the wiring, occurrence of a hillock and a pinhole is substantially completely suppressed.


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