The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
May. 25, 2000
Andrew Zachary Glovatsky, Plymouth, MI (US);
Brenda Joyce Nation, Troy, MI (US);
Charles Frederick Schweitzer, Northville, MI (US);
Daniel Phillip Dailey, West Bloomfield, MI (US);
Delin Li, Canton, MI (US);
Jay DeAvis Baker, Dearborn, MI (US);
Lakhi Nandlal Goenka, Ann Arbor, MI (US);
Lawrence LeRoy Kneisel, Novi, MI (US);
Myron Lemecha, Dearborn Heights, MI (US);
Visteon Global Technology, Inc., Dearborn, MI (US);
Abstract
An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.