The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Jul. 19, 1996
Ichiro Kataoka, Tsuzuki-gun, JP;
Takahiro Mori, Ikoma, JP;
Satoru Yamada, Tsuzuki-gun, JP;
Hidenori Shiotsuka, Tsuzuki-gun, JP;
Ayako Komori, Nara, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor device having a semiconductor element, characterized in that said semiconductor device comprises a stacked body obtained by providing a laminate comprising said semiconductor element and a sealing resin which are interposed between a front surface member and a back face member, evacuating said laminate at a vacuum of 5 Torr or less for 5 to 40 minutes, subjecting the laminate thus treated to thermocompression bonding at a vacuum degree of 5 Torr or less, and cooling the laminate subjected to said thermocompression bonding so as to engage in contact bonding. The laminated semiconductor device is free of the air bubbles therein.