The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Jun. 06, 1996
Masayuki Ochiai, Kawasaki, JP;
Yasuo Yamagishi, Kawasaki, JP;
Ichiro Yamaguchi, Kawasaki, JP;
Masahiro Yoshikawa, Kawasaki, JP;
Koki Otake, Kawasaki, JP;
Masataka Mizukoshi, Kawasaki, JP;
Yuuji Watanabe, Aizuwakamatsu, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.