The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Apr. 24, 2000
Alexander Tain, Milpitas, CA (US);
Joan L. Tan, Santa Clara, CA (US);
Valerie Vivares, Palo Alto, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A novel method of automatically routing connections from bumps on a die to package pins in an advanced IC package such as a flip-chip package. The method involves creating graphic presentations of the die having the bumps and the package having pins, and placing the graphic presentation of the die into the graphic presentation of the package. If a netlist identifying interconnections between the bumps and the pins is available, the best route from a bump on the die to a corresponding package pin identified in the netlist is generated in accordance with preset requirements. If the netlist is not available, the best route from the bump to any package pin is generated in accordance with the preset requirements.