The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Jun. 01, 2000
Applicant:
Inventors:
Lee Yong Hoon, Hiratsuka, JP;
Takeji Kajiura, Isehara, JP;
Assignee:
Komatsu Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract
To provide a method for manufacturing a thermoelectric semiconductor material or a thermoelectric semiconductor element and method for manufacturing a thermoelectric module effective in improving thermoelectric performance. The thermoelectric semiconductor material is manufactured by producing a laminated body of thin powders manufactured by a quenching roller method, and compressing simultaneously the side surfaces of the laminated body using a secondary punch.
Hoon, Lee. (2001). Method for manufacturing a thermoelectric semiconductor material or element and method for manufacturing a thermoelectric module (U.S. Patent No. 6319744). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6319744
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile