The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Sep. 14, 1999
Applicant:
Inventor:
Hiroji Ozaki, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G01R 3/126 ; H01L 2/166 ; H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
G01R 3/126 ; H01L 2/166 ; H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A manufacturing system compares information of foreign matter sensed by semiconductor equipment from on a semiconductor substrate with a selection reference thereby selecting optimum semiconductor equipment corresponding to the information of the foreign matter from a plurality of semiconductor equipment and processing the semiconductor substrate. Thus, a method of manufacturing a semiconductor device capable of improving the yield of the semiconductor device as well as a manufacturing system and semiconductor equipment to which the manufacturing method is applied, and a semiconductor device manufactured by the same are obtained.