The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Jan. 30, 2001
Applicant:
Inventors:
Shinjiro Domi, Osaka, JP;
Koichi Sakaguchi, Osaka, JP;
Shigeki Nakagaki, Osaka, JP;
Katsuaki Suganuma, Osaka, JP;
Assignee:
Nippon Sheet Glass Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/526 ;
U.S. Cl.
CPC ...
B23K 3/526 ;
Abstract
A lead-free solder alloy substantially contains Sn and Ti, and has a temperature of a liquidus line of not greater than 400° C. The lead-free solder alloy contains no toxic lead and has sufficient bonding strength to oxide materials such as glass and ceramics.