The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2001

Filed:

Dec. 01, 1999
Applicant:
Inventor:

Takayuki Yamada, Yokkaichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/300 ;
U.S. Cl.
CPC ...
H01R 4/300 ;
Abstract

A wire laying apparatus is provided which can easily position a wire with respect to a work and improve an operability when the wire is laid on the work. The wire laying apparatus is provided with a base,a turntable,a support frame,a wire laying mechanism,a press cutting mechanism,and a press insulation-displacing mechanism,Pieces of an insulated wire,to which a wire laying process and a press cutting process have been applied are pushed by pushing portions,from above a wire laying mold,during a press insulation-displacing process, thereby being transferred from the wire laying mold,to a work piece,located below. In this case, the pieces of the insulated wire,tightly held by the wire laying mold,are transferred to specified positions on the work piece,while a layout pattern thereof is maintained, and laid on the work,while being fastened to wire mounts and insulating-displacing pieces.


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