The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2001
Filed:
Feb. 01, 2000
Applicant:
Inventors:
Shiaw-Jong Steve Chen, Plano, TX (US);
Roger J. Hooey, Rockwall, TX (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H 7/20 ;
U.S. Cl.
CPC ...
H05H 7/20 ;
Abstract
The present invention provides an encapsulant structure for retaining an electronic circuit having heat-generating components within a case that at least partially surrounds the electronic circuit. In one advantageous embodiment, the encapsulant structure provides for a thermally conductive insert to be located within the case proximate the heat-generating components. The insert increases the heat transfer efficiency from the electronic circuit to the case.
Quick Actions:
Chen, Shiaw-Jong. (2001). Encapsulated power supply with a high thermal conductivity molded insert (U.S. Patent No. 6317324). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6317324
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile