The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2001

Filed:

May. 19, 2000
Applicant:
Inventors:

Katsutoshi Nakagawa, Yokohama, JP;

Fumiyuki Kawashima, Matsudo, JP;

Takao Sawa, Yokohama, JP;

Shinya Sakurada, Tokyo, JP;

Tomohisa Arai, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/02 ;
U.S. Cl.
CPC ...
H01F 7/02 ;
Abstract

A bond magnet comprises a molded body in which a mixture of flake of magnet material comprising rare earth element-iron-nitrogen as main component, TbCu,type crystal phase as a principal phase and a thickness of less than 200 &mgr;m a binder is compression molded. A compression molded body constituting a bond magnet has a density of 6×10,kg/m,or more. In the step of compression molding a mixture of magnet material and binder, pressure is applied a plurality of times, or pressure is applied while rotating a punch and die, or the binder is cured while applying pressure to obtain such a bond magnet with good reproducibility. Such a bond magnet has excellent magnetic properties and corrosion resistance.


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