The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2001

Filed:

Mar. 09, 2000
Applicant:
Inventors:

Ron Barnett, Santa Rosa, CA (US);

Charles Joseph Buondelmonte, Yardley, PA (US);

Ilya Alexander Korisch, Somerset, NJ (US);

Louis Thomas Manzione, Summit, NJ (US);

Richard F Schwartz, Cranbury, NJ (US);

Hui Wu, Union, NJ (US);

Assignee:

Avaya Technology Corp., Basking Ridge, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 5/08 ;
U.S. Cl.
CPC ...
H01P 5/08 ;
Abstract

A resonant capacitive coupler (,) couples signals across a gap (,) between signal transmission lines (,) of two printed wiring boards (,). The coupler has a conductive contact member (,or,) that is either positioned in close proximity to one of the transmission lines (,) or is connected to the one transmission line via a dielectric (,or,), and forms a capacitor therewith. The coupler further has a conductive interconnect member (,or,) that is connected to the contact member, and also to the other transmission line (,) either directly (FIG.,) or via a second conductive contact member (,) (FIG.,). The conductive interconnect member is dimensioned to have an inductive impedance at the frequency of the signals that equals, and hence cancels out, the capacitive impedance of the one or two capacitors formed by the one or two contact members. The coupler therefore resonates at the signal frequency, and relative to conventional capacitive coupling achieves a low-loss interconnection over large gaps while requiring only small capacitance to do so.


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