The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2001
Filed:
Jul. 25, 2000
Hiroshi Otani, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A sensor substrate (,) is mounted on a signal processing substrate (,), and a sealing resin (,) is so provided as to extend from an edge portion of the sensor substrate (,) onto a main surface of the signal processing substrate (,). The sealing resin (,) is provided over the whole outer peripheral region of the sensor substrate (,), and the sealing resin (,), the sensor substrate (,) and the signal processing substrate (,) define the sealed space (SP). The sensor substrate (,) has a plurality of bumps (,) on its main surface and makes an electrical connection with the signal processing substrate (,) by bonding the bumps (,) to an electrode provided on the main surface of the signal processing substrate (,). With this structure, a semiconductor device which allows reduction in manufacturing cost by omitting a cap which protects moving part of the sensor substrate can be achieved.