The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2001
Filed:
Nov. 13, 1998
Applicant:
Inventors:
Koji Tsuzuki, Ikoma, JP;
Tsutomu Murakami, Nara, JP;
Satoru Yamada, Nara, JP;
Yoshifumi Takeyama, Kyoto, JP;
Koichi Shimizu, Kyotanabe, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/398 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/398 ; H01L 2/352 ; H01L 2/940 ;
Abstract
A moldless semiconductor device comprising a semiconductor chip held between outer-connecting terminals and connected electrically to the terminals is provided. At least one of the two terminals has, at its region contiguous to the semiconductor chip or at its region contiguous to the semiconductor chip and a region vicinal thereto, a hardness different from all other regions of the one terminal. This moldless semiconductor device can withstand significant external force and exhibits high reliability when used in photovoltaic device modules.