The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2001
Filed:
Oct. 06, 1998
Applicant:
Inventors:
Suan-Jong Jae Boon, Singapore, SG;
Jing Sua Goh, Singapore, SG;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/328 ; H01L 2/304 ;
U.S. Cl.
CPC ...
H01L 2/328 ; H01L 2/304 ;
Abstract
A reinforced semiconductor package (,) and method utilizes at least one of the grooves (,) and ridges (,) formed on the package body (,) to reinforce the package body (,) to prevent warping of the package after molding.