The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2001
Filed:
Jul. 08, 1999
Applicant:
Inventors:
Kazutoshi Iida, Kanagawa, JP;
Jon Wigham, Dublin, IE;
Assignee:
Loctite (R&D) Limited, Dublin, IE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 2/325 ;
U.S. Cl.
CPC ...
C08L 2/325 ;
Abstract
The present invention provides a thermosetting resin composition useful as an underfilling sealing resin which enables a semiconductor device, such as a CSP/BGA assembly which includes a semiconductor chip mounted on a carrier substrate, to be securely connected to a circuit board by short-time heat curing and with good productivity, which demonstrates excellent heat shock properties (or thermal cycle properties), and permits the CSP/BGA assembly to be easily removed from the circuit board in the event of semiconductor device or connection failure.