The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2001

Filed:

Mar. 29, 2000
Applicant:
Inventors:

Syunji Wada, Osaka, JP;

Hiroshi Yagawa, Osaka, JP;

Motohisa Mineo, Osaka, JP;

Yuichi Aoki, Osaka, JP;

Ryoji Chikugo, Niihama, JP;

Akihiko Yoshii, Niihama, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/120 ;
U.S. Cl.
CPC ...
H01L 2/120 ;
Abstract

A method of manufacturing a transparent conductive film is provided, which is capable of obtaining a transparent conductive film having both reduced specific resistance and reduced film compressive stress, and a transparent conductive film manufactured by the same method is also provided. The temperature of a substrate placed in opposed relation to an anode is set to not more than 130° C. A plasma beam is generated by discharge plasma generating means constituting a cathode and guided to the anode such that an evaporation material received in the anode evaporates and particles of the evaporated materials are ionized, to thereby form the transparent conductive film on a surface of the substrate. The transparent conductive film thus formed is subjected to a heat treatment at a temperature of not less than 180° C. The resulting transparent conductive film has a specific resistivity of 230 &mgr;&OHgr;·cm or less and a film compressive stress of 0.35 GPa or less.


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