The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2001
Filed:
Sep. 20, 2000
Naoto Hiramatsu, Shin-Nanyo, JP;
Sadayuki Nakamura, Shin-Nanyo, JP;
Kazuyuki Kageoka, Shin-Nanyo, JP;
Nisshin Steel Co., Ltd., , JP;
Abstract
A new stainless steel sheet has a stainless steel substrate which contains Cu at a ratio of 1.0 wt. % or more and has Cu-enriched grains precipitated at a ratio of 0.2 vol. %. The Cu-enriched grains are exposed to the outside through pinholes in a passive film generated on the substrate. Cu is preferably condensed at a Cu/(Cr+Si) weight ratio of 0.1 or more or a Cu/(Si+Mn) weight ratio of 0.5 or more with respect to Cr, Si and Mn present in the passive film or at an outermost layer of the substrate. Precipitation of Cu-enriched grains and condensation of Cu effectively improve solderability and electric conductivity of the stainless steel sheet.